ESD testing and combdrive snap-in in a MEMS tunable grating under shock and vibration

This work describes a method for tracking the dynamics of electrostatic discharge (ESD) sensitive MEMS structures during ESD events, as well as a model for determining the reduced combdrive snap-in voltage under vibration and shock. We describe our ESD test setup, based on the human body model, and optimized for high impedance devices. A brief description of the MEMS tunable grating, the test structure used here, and its operation is followed by results of the measured complex device dynamics during ESD events. The device fails at a voltage up to four times higher than that required to bring the parts into contact. We then present a model for the snap-in of combfingers under shock and vibration. We combine the results of the analytical model for combdrive snap-in developed here with a shock response model to compute the critical shock acceleration conditions that can result in combdrive snap-in as a function of the operating voltage. We discuss the validity regimes for the combdrive snap-in model and show how restricting the operation voltage below the snap-in voltage is not a sufficient criterion to ensure reliable operation especially in environments with large disturbances.

[1]  Jeremy A. Walraven,et al.  MEMS reliability in a vibration environment , 2000, 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059).

[2]  Herbert Shea,et al.  Vibration and shock reliability of MEMS: modeling and experimental validation , 2011 .

[3]  Mirko Scholz,et al.  Investigating ESD sensitivity in electrostatic SiGe MEMS , 2010 .

[4]  Stuart B. Brown,et al.  Subcritical crack growth in silicon MEMS , 1999 .

[5]  G. Meneghesso,et al.  Electrostatic Discharge and Cycling Effects on Ohmic and Capacitive RF-MEMS Switches , 2007, IEEE Transactions on Device and Materials Reliability.

[6]  Yves-Alain Peter,et al.  Deformable MEMS grating for wide tunability and high operating speed , 2006 .

[7]  Jeremy A. Walraven,et al.  MEMS reliability in shock environments , 2000, 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059).

[8]  B. Krauskopf,et al.  Proc of SPIE , 2003 .

[10]  Robert Puers,et al.  Creep-resistant aluminum alloys for use in MEMS , 2005 .

[11]  Herbert Shea,et al.  MEMS Reliability , 2010 .