Distributed elements and MM-wave characterization of low cost MCM-D substrates

Future telecommunication aplications will shift more and more to the use of higher frequncies. Multichip Modules (MCMs) and MCM technologies are very close to micro- and milimeter-wave systems like transmitter/receivr (T/R) for radars and communication modules for wireless infrastructure links. There are various stringent requirements for MCMs in the frequency range of I to 100GHz but one of the most critical requirements is the ability of high yield and high volume production together with the low cost and high RF performance. Integration of RF circuits and elements with digital and analog circuits on the same substrate is essential to reduce the overall cost and physical dimensions of the whole system. One of the most difficult elements to integrate in such a module is the antenna because the technological requirements driven by its performance characteristics (radiation efficiency, bandwidth) are opposite to these of non-radiating elements, where the radiation effect is not desirable. This paper will discuss the EM based modelling and practical design of microstrip and novel slot antennas in the mm-wave frequency range (30-90GHz) on low cost MCM-D substrates. The critical parameters of milimeter design such as losses, bandwidth, radiation pattern and the influence of process characteristics and tolerances on antenna performance will be discussed. To perform this feasibility study a Finite Element Method (FEM) is used. To validate the technolgy the electrical substrate characterization up to 115GHz and implementetion of an arbitrarily chosen microstrip filter at 80-90GHz is reported.

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