MODELING AND OPTIMIZATION OF REFLOW THERMAL PROFILING OPERATION: A COMPARATIVE STUDY

ABSTRACT In this study, a comparative study of optimizing the reflow thermal profiling parameters using a hybrid artificial intelligence and the desirability function approaches without/with combining multiple performance characteristics into a single desirability is presented. Reflow soldering is the key determinant for the improvement of the first-pass yields of electronics assembly. A reflow thermal profile is a time-temperature contour with multiple performance characteristics utilized to monitor the heating effects on a printed circuit board (PCB) and surface mount components (SMCs) in the reflow oven. The use of an inadequate reflow thermal profile may not only produce a variety of soldering failures, but can also result in the needs for considerable reworking and waste. An L18 (21*37) Taguchi experiment design is conducted to collect the thermal profiling data. A quick propagation (QP) neural network is modeled based on experimental data to formulate the nonlinear relationship between the thermal p...

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