Microsystem optoelectronic integration for mixed multisignal systems

The integration and packaging of optoelectronic devices with electronic circuits and systems has growing application in many fields, ranging from long to micro haul links. An exploration of the opportunities, integration technologies, and some recent results using thin-film device heterogeneous integration with Si CMOS VLSI and GaAs MESFET circuit technologies are presented. Applications explored include alignment tolerant optoelectronic links for network interconnections, smart pixel focal plane array processing through the integration of imaging arrays with sigma delta analog to digital converters underneath each pixel, and three-dimensional computational systems using vertical through-Si optical interconnections.

[1]  April S. Brown,et al.  A three-layer 3D silicon system using through-Si vertical optical interconnections and Si CMOS hybrid building blocks , 1999 .

[2]  C. Camperi-Ginestet,et al.  Alignable epitaxial liftoff of GaAs materials with selective deposition using polyimide diaphragms , 1991, IEEE Photonics Technology Letters.

[3]  Stuart K. Tewksbury,et al.  GaAs heteroepitaxy with submicron Si CMOS: an experimental compatibility study , 1993, Photonics West - Lasers and Applications in Science and Engineering.

[4]  D. Scott Wills,et al.  Mixed Signal Hybrid OEICs: An InP I-MSM Integrated Onto a CMOS Analog Optical Receiver with a Digital CMOS Microprocessor , 1999 .

[5]  B. Buchanan,et al.  8 x 8 array of thin-film photodetectors vertically electrically interconnected to silicon circuitry , 1995, IEEE Photonics Technology Letters.

[6]  April S. Brown,et al.  Design issues for through-wafer optoelectronic multicomputer interconnects , 1995, Proceedings of Second International Workshop on Massively Parallel Processing Using Optical Interconnections.

[7]  Dean Tsang.  Optical interconnections for digital computing systems , 1991 .

[8]  O. Vendier,et al.  Stacked silicon CMOS circuits with a 40-Mb/s through-silicon optical interconnect , 1998, IEEE Photonics Technology Letters.

[9]  Richard P. Leavitt,et al.  High efficiency thin-film GaAs-based MSM photodetectors , 1996 .

[10]  H. Baltes,et al.  Analytic representation of the silicon absorption coefficient in the indirect transition region. , 1988, Applied optics.

[11]  R.T. Chen,et al.  1-to-27 highly parallel three-dimensional intra- and inter-board optical interconnects , 1994, IEEE Photonics Technology Letters.

[12]  James D. Meindl.  Gigascale integration: is the sky the limit? , 1996 .

[13]  Martin A. Brooke,et al.  IRIS: an integrated, scalable focal plane architecture , 1998, Conference Proceedings. LEOS'98. 11th Annual Meeting. IEEE Lasers and Electro-Optics Society 1998 Annual Meeting (Cat. No.98CH36243).

[14]  D. Miller,et al.  GaAs-AlGaAs multiquantum well reflection modulators grown on GaAs and silicon substrates , 1989, IEEE Photonics Technology Letters.

[15]  L. Hornak,et al.  On the feasibility of through-wafer optical interconnects for hybrid wafer-scale-integrated architectures , 1987, IEEE Transactions on Electron Devices.

[16]  D. Staiculescu,et al.  Design rule development for microwave flip-chip applications , 2000 .

[17]  N.M. Jokerst,et al.  Systolic processing architectures using optoelectronic interconnects , 1997, Proceedings of the Fourth International Conference on Massively Parallel Processing Using Optical Interconnections.

[18]  Tomasz P. Jannson,et al.  60 GHz board-to-board optical interconnection using polymer optical buses in conjunction with microprism couplers , 1992 .

[19]  Nan Marie Jokerst,et al.  Alignment Tolerant Smart Pixel Bi-Directional Optoelectronic Links Using Co-Located Emitters and Detectors , 1998 .

[20]  S. Siala,et al.  Optical receiver systems for high speed parallel digital data links , 1995 .

[21]  A. Willner,et al.  Multiple-layer optical interconnections using through-wafer hollow-dielectric-waveguide vias , 1994, IEEE Photonics Technology Letters.

[22]  A. Lopez-Lagunas,et al.  A single-fiber bidirectional optical link using colocated emitters and detectors , 1996, IEEE Photonics Technology Letters.

[23]  Ashok V. Krishnamoorthy,et al.  Optoelectronic-VLSI: photonics integrated with VLSI circuits , 1998 .

[24]  N.M. Jokerst,et al.  Improvement in bit-error rate for optoelectronic multicomputer interconnection networks using cyclic redundancy code error detection , 1997, IEEE Photonics Technology Letters.

[25]  O. Vendier,et al.  Intergrated 1.55 /spl mu/m receivers using GaAs MMICs and thin film InP detectors , 1998, 1998 IEEE MTT-S International Microwave Symposium Digest (Cat. No.98CH36192).

[26]  N. Jokerst,et al.  Vertical optical communication through stacked silicon wafers using hybrid monolithic thin film InGaAsP emitters and detectors , 1993, IEEE Photonics Technology Letters.

[27]  Shin Yokoyama,et al.  Three-dimensional memory LSI with optical interconnections , 1993 .

[28]  C. Camperi-Ginestet,et al.  Communication through stacked silicon circuitry using integrated thin film InP-based emitters and detectors , 1995, IEEE Photonics Technology Letters.

[29]  Sungyong Jung,et al.  Hybrid optically interconnected microprocessor: an InP I-MSM integrated onto a mixed-signal CMOS analog optical receiver with a digital CMOS microprocessor , 2000, International Topical Meeting on Optics in Computing.

[30]  J. E. Leight,et al.  Experimental demonstration of a four-plane 2-D multiple-wavelength optical interconnection using integrated VCSEL arrays and MQW/DBR detectors , 1997, IEEE Photonics Technology Letters.

[31]  J. Tabler,et al.  An 8/spl times/8 array of resonant cavity enhanced light emitting diodes integrated onto silicon grayscale (32 level) driver circuitry , 1996, Conference Proceedings LEOS'96 9th Annual Meeting IEEE Lasers and Electro-Optics Society.

[32]  Yue Liu,et al.  Smart-pixel array technology for free-space optical interconnects , 2000, Proceedings of the IEEE.

[33]  A. Waxman,et al.  Through-wafer optical communication using monolithic InGaAs-on-Si LEDs and monolithic PtSi-Si Schottky-barrier detectors , 1991, IEEE Photonics Technology Letters.

[34]  Martin A. Brooke,et al.  Scaleable CMOS Current-Mode Preamplifier Design for an Optical Receiver , 1997 .

[35]  O. Vendier,et al.  Thin-film inverted MSM photodetectors , 1996, IEEE Photonics Technology Letters.

[36]  F.J. Leonberger,et al.  Optical interconnections for VLSI systems , 1984, Proceedings of the IEEE.

[37]  Thomas G. Brown,et al.  Optical Emission From Crystalline Silicon , 1987, Other Conferences.