Creating compact models using standard spreadsheet software

Methods are proposed for the determination of boundary conditions independent (BCI) compact thermal models. These flexible techniques can be utilized in combination with the input/output capabilities and standard functions of common spreadsheet programs, which are particularly useful in the process of error minimization. First, the steady-state is considered where resistor models are applicable. On a fast time scale, one-dimensional Cauer resistor-capacitor networks are sufficient to model transient behavior. This paper presents a way to obtain analytical solutions for RC ladders of arbitrary size. The method also eases network conversion. The steady-state and short-time behavior is used as basis information for derivation of BCI transient models. A numerical integration technique applicable to any network is outlined. The proposed techniques are used within the process of development of a transient BCI model for Infineon's BTS840S2 dual chip device, assembled in a P-DSO-20-10 package, which predicts the junction temperatures for any switching state.

[1]  H. Pape,et al.  Generation and verification of boundary independent compact thermal models for active components according to the DELPHI/SEED methods , 1999, Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306).

[2]  F. W. Kellaway,et al.  Advanced Engineering Mathematics , 1969, The Mathematical Gazette.

[3]  T. Hauck,et al.  Thermal RC-network approach to analyze multichip power packages , 2000, Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068).

[4]  I N Bronstein,et al.  Taschenbuch der Mathematik , 1966 .

[5]  P. Stehouwer,et al.  Creation and evaluation of compact models for thermal characterisation using dedicated optimisation software , 1999, Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306).

[6]  Staude Bronstein, I. N., und Semendjajew, K. A.: Taschenbuch der Mathematik für Ingenieure und Studenten der Technischen Hochschulen. Verlag B. G. Teubner, Leipzig 1958, 548 Seiten, DM 22,50 , 1959 .

[7]  G. Wachutka,et al.  Calculation of the temperature development in electronic systems by convolution integrals , 2000, Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068).