论文信息 - A method to maintain phase-change memory pre-coding data retention after high temperature solder bonding process in embedded systems - 字舞流文

A method to maintain phase-change memory pre-coding data retention after high temperature solder bonding process in embedded systems

M. Breitwisch | S. Raoux | Y. Shih | E. Lai | C. Lam | A. Schrott | M. Lee | R. Cheek | C. Chen | E. Joseph | H. Lung | Y. Zhu | R. Dasaka | P. Du | H. Cheng | J.Y. Wu | T.Y. Wang