Highly efficient PERC cells fabricated using the low cost laser ablation process

Abstract Highly efficient passivated emitter and rear cells (PERC cells) were fabricated using low cost laser ablation (LA) for pilot production. The laser source for the LA system had a wavelength of 532 nm and pulse width of 20 ns. To minimize the damage created during the LA process, the laser power density was optimized at 2.8 J/cm 2 . Nevertheless, some damage occurred, such as dislocation and the formation of amorphous silicon, and was analyzed using energy-dispersive X-ray spectroscopy (EDS), Raman spectroscopy, and Sinton's quasi-steady-state photo-conductance (QSSPC). The measured laser damage depth was approximately 2.5 μm. Since the local contact depth (eutectic alloy+back surface field (BSF)) was over 10 μm when the cell fabrication was completed, this laser damage depth of 2.5 μm was not problematic. After optimizing the geometry of the local contacts, the measured efficiency of the laser-ablated PERC solar cell was 19.78%.

[1]  Wmm Erwin Kessels,et al.  Surface passivation of high‐efficiency silicon solar cells by atomic‐layer‐deposited Al2O3 , 2008 .

[2]  A. Cavalleri,et al.  Femtosecond Structural Dynamics in VO2 during an Ultrafast Solid-Solid Phase Transition. , 2001, Physical review letters.

[3]  A. Mette,et al.  Thermal oxidation for crystalline silicon solar cells exceeding 19% efficiency applying industrially feasible process technology , 2008 .

[4]  E. Ose,et al.  Local structuring of dielectric layers on silicon for improved solar cell metallization , 2007 .

[5]  Andrew Evert Carlson Device and circuit techniques for reducing variation in nanoscale SRAM , 2008 .

[6]  K. Ramspeck,et al.  Rear-surface passivation technology for crystalline silicon solar cells: A versatile process for mass production , 2012, 2012 IEEE 38th Photovoltaic Specialists Conference (PVSC) PART 2.

[7]  Dieter Bäuerle,et al.  Laser processing and chemistry: recent developments , 2002 .

[8]  M. Green,et al.  22.8% efficient silicon solar cell , 1989 .

[9]  A. Singh,et al.  Laser damage studies of silicon surfaces using ultra-short laser pulses , 2002 .

[10]  K. Bothe,et al.  19.4%‐efficient large‐area fully screen‐printed silicon solar cells , 2011 .

[11]  Brent C. Stuart,et al.  Optical ablation by high-power short-pulse lasers , 1996 .

[12]  R. Yen,et al.  Picosecond laser‐induced melting and resolidification morphology on Si , 1979 .

[13]  Krister Mangersnes,et al.  Damage free laser ablation of SiO2 for local contact opening on silicon solar cells using an a-Si:H buffer layer , 2010 .

[14]  B. Luther-Davies,et al.  Ablation of solids by femtosecond lasers: ablation mechanism and ablation thresholds for metals and dielectrics , 2002 .

[15]  R. Brendel,et al.  Towards 20% efficient large‐area screen‐printed rear‐passivated silicon solar cells , 2012 .

[16]  Perry,et al.  Laser-induced damage in dielectrics with nanosecond to subpicosecond pulses. , 1995, Physical review letters.

[17]  Ulrich Klug,et al.  Laser ablation of SiO2 for locally contacted Si solar cells with ultra‐short pulses , 2007 .

[18]  Philippe M. Fauchet,et al.  Growth of spontaneous periodic surface structures on solids during laser illumination , 1982 .