Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structure
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[1] Yi-Shao Lai,et al. Thermomigration in SnPb composite flip chip solder joints , 2006 .
[2] Chih Chen,et al. Redistribution of Pb-rich phase during electromigration in eutectic SnPb solder stripes , 2006 .
[3] Chih Chen,et al. Investigation of void nucleation and propagation during electromigration of flip-chip solder joints using x-ray microscopy , 2006 .
[4] King-Ning Tu,et al. Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints , 2006 .
[5] S. W. Liang,et al. Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes , 2006 .
[6] King-Ning Tu,et al. Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration , 2006 .
[7] King-Ning Tu,et al. Current-crowding-induced electromigration failure in flip chip solder joints , 2002 .
[8] Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints , 2007 .
[9] Y. Liu,et al. Geometrical effect of bump resistance for flip-chip solder joints: Finite-element modeling and experimental results , 2006 .
[10] K. Tu. Recent advances on electromigration in very-large-scale-integration of interconnects , 2003 .