Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging

Multi-layered stacks are commonly used in microelectronic packaging. Traditionally,these systems are designed using linear-elastic analysis either with analytical solutions orfinite element method. Linear-elastic analysis for layered structures yields very conserva-tive results due to stress singularity at the free edge. In this paper, it is shown that adamage mechanics based nonlinear analysis not just leads to a more realistic analysis butalso provides more accurate stress distribution. In this paper these two approaches arecompared. Moreover, mesh sensitivity of the finite element analysis in stack problems isstudied. It is shown that the closed form and elastic finite element analyses can only beused for preliminary studies and elastic finite element method is highly mesh sensitive forthis problem. In elastic analysis the stress singularity at the free edge makes mesh selec-tion very difficult. Even when asymptotic analysis is used at the free edge, the results arevery conservative compared to an inelastic analysis. Rate sensitive inelastic analysis doesnot suffer from the stress singularity and mesh sensitivity problems encountered in elasticanalysis. @DOI: 10.1115/1.1362674#

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