论文信息 - Failure analysis of lead‐free solder joints for high‐density packages

Failure analysis of lead‐free solder joints for high‐density packages

Failure analyses of the lead‐free and SnPb solder joints of high‐density packages such as the plastic ball grid array and the ceramic column grid array soldered on SnCu hot‐air solder levelling electroless nickel‐immersion gold or NiAu, and organic solderability preservative Entek printed circuit boards are presented. Emphasis is placed on determining the failure locations, failure modes, and intermetallic compound composition for these high‐density packages' solder joints after they have been through 7,500 cycles of temperature cycling. The present results will be compared with those obtained from temperature cycling and finite element analysis.

[1] John H. Lau,et al. Design, materials and process for lead‐free assembly of high‐density packages , 2004 .

[2] D. Goyal,et al. Failure mechanism of brittle solder joint fracture in the presence of electroless nickel immersion gold (ENIG) interface , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

[3] J. Lau,et al. Design for lead‐free solder joint reliability of high‐density packages , 2004 .

[4] John H. Lau,et al. Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials , 2002 .

[5] Young-Doo Jeon,et al. Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless nickel UBM-solder interface and their effects on flip chip solder joint reliability , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

[6] Y. C. Chan,et al. Reliability studies /spl mu/BGA solder joints-effect of Ni-Sn intermetallic compound , 2001 .

[7] John H. Lau,et al. Reliability testing and data analysis of lead‐free solder joints for high‐density packages , 2004 .