论文信息 - Influences of the initial thickness of the interfacial IMC layer on electromigration behavior of Cu/Sn/Cu microscale joints - 字舞流文

Influences of the initial thickness of the interfacial IMC layer on electromigration behavior of Cu/Sn/Cu microscale joints

H. Qin | W. Yue | Xin-Ping Zhang | X. Ma | M. Zhou | Guang-Sui Xu | S. Cao