Modelling Electromigration and Induced Stresses In Aluminum Lines

The various equations used by different authors for describing electromigration are compiled. All of them can be derived from a general equation which is based on a vacancy model. During the derivation of simplified versions of the general equations assumptions have to be made and their effect on concentration profiles and/or electromigration stresses developing as a function of time are discussed. Consequences with respect to Blech's experiment or the current exponent in Black's equation are taken into consideration and a simple explanation is provided for the beneficial effect of a (111) texture on the reliability of Al-lines.

[1]  Reiner Kirchheim,et al.  Stress and electromigration in Al-lines of integrated circuits , 1992 .

[2]  Reiner Kirchheim,et al.  Atomistic and computer modeling of metallization failure of integrated circuits by electromigration , 1991 .

[3]  M. Korhonen,et al.  Electromigration in Aluminum Based Interconnects of VLSI-Microcircuits, with and without Preceding Stress-Migration Damage , 1991 .

[4]  J. McPherson,et al.  Effeci of Stresses on Void Nucleation During Electromigration , 1991 .

[5]  C. Herzig,et al.  Grain Boundary Self-Diffusion in Silver Bicrystals , 1991 .

[6]  C. Ross,et al.  A model for electromigration behaviour in terms of flux divergences , 1987 .

[7]  James R. Lloyd,et al.  A model for conductor failure considering diffusion concurrently with electromigration resulting in a current exponent of 2 , 1986 .

[8]  S. Vaidya,et al.  Effect of texture and grain structure on electromigration in Al-0.5%Cu thin films , 1981 .

[9]  R. Kirchheim.  Zur Lösung des 2. Fickschen Gesetzes unter nicht‐isothermen Bedingungen in Gegenwart von äußeren Kräften , 1979 .

[10]  V. Vítek,et al.  Periodic grain boundary structures in aluminium I. A combined experimental and theoretical investigation of coincidence grain boundary structure in aluminium , 1977, Proceedings of the Royal Society of London. A. Mathematical and Physical Sciences.

[11]  I. Blech.  Electromigration in thin aluminum films on titanium nitride , 1976 .

[12]  Robert Rosenberg,et al.  Void Formation and Growth During Electromigration in Thin Films , 1971 .

[13]  G. Martin,et al.  Autodiffusion au joint de grains de bicristaux d'argent soumis à une pression hydrostatique , 1967, September 1.

[14]  P. Mazur,et al.  Non-equilibrium thermodynamics, , 1963 .

[15]  H. B. Huntington,et al.  Current-induced marker motion in gold wires☆ , 1961 .

[16]  R. Hoffman.  Anisotropy of grain boundary self-diffusion ☆ , 1956 .

[17]  R. E. Hoffman,et al.  The effect of relative crystal and boundary orientations on grain boundary diffusion rates , 1954 .