Reliability of solder joints under electrical stressing - strain evolution of solder joints

Damage mechanics of solder interconnects under electrical stressing is an important reliability issue for next generation power electronic packaging as well as for future IC packaging. The high electrical stressing in solder joints leads to electromigration and thus could not be ignored. In this paper, the state-of-the-art research on electromigration in solder joints is reviewed. An experimental electromigration study on solder joints is conducted and results are reported in this paper. The strain field in the solder joints under electrical stressing is measured with Moire Interferometry technique.