Silicon-on-silicon MCMs with integrated passive components
暂无分享,去创建一个
The authors evaluate a prototype silicon-on-silicon multichip module for potential use in cost-driven applications. The incorporation of integrated passive components, resistors and capacitors, in the module substrate is a significant advantage in many of these kinds of applications. A module has been built that incorporates both linear and bipolar and digital CMOS circuits. The unique features of the module are discussed, as well as the properties and performance limits of the resulting passive components.<<ETX>>
[1] R.R. Johnson. Multichip modules: next-generation packages , 1990, IEEE Spectrum.
[2] L. Schaper,et al. Interconnection Costs of Various Substrates-The Myth of Cheap Wire , 1984 .
[3] G. Messner. Cost-Density Analysis of Interconnections , 1987 .