SSL Case Study: Package, Module, and System

As early as 2004, high power LED was expected to be the dominant lighting technology by 2025. Nowadays, this tendency is becoming more and more obvious based on the higher luminous efficiency and reliability. Many case studies, like thermal design and analysis, junction temperature measurement, reliability assessment, etc., focus on package and module level product. However, for actual application of solid state lighting (SSL) system, only a few studies are carried out by now. Generally, the material degradation and structure damage due to the electrical, thermal, chemical, and mechanical stress will lead to the lumen degradation, color variation or even early death of LEDs. It is clear that SSL system reliability is a challenging and important task that needs to be addressed. In this chapter, the LED reliability issues are divided into four categories according to the LED product forms, which are reliability of LED package, reliability of LED module, reliability of multichip LED module, and reliability of LED system. Several case studies are used to illustrate each kind of LED reliability issues by theoretical/numerical modeling, reliability test, various methods and experiments.

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