论文信息 - Intragranular Thermal Fatigue of Cu Thin Films: Near-Grain Boundary Hardening, Strain Localization and Voiding - 字舞流文

Intragranular Thermal Fatigue of Cu Thin Films: Near-Grain Boundary Hardening, Strain Localization and Voiding

C. Yildirim | I. Greving | C. Detlefs | S. Flenner | J. Todt | T. Ziegelwanger | M. Meindlhumer | J. Keckes | J. Kopeček | M. Reisinger | S. Beuer | K. Hlushko | M. Rommel