Water cooled minichannel heat sinks for microprocessor cooling: Effect of fin spacing

Abstract For effective thermal management of high heat generating microprocessors, five different heat sinks with fin spacings of 0.2 mm, 0.5 mm, 1.0 mm, and 1.5 mm along with a flat plate heat sink were investigated. Microprocessor heat was simulated by a heated copper block with water as a coolant. At a heater power of 325 W, the lowest heat sink base temperature of 40.5 °C was achieved by using a heat sink of 0.2 mm fin spacing which was about 9% lower than the best reported base temperature of 44 °C using a nanofluid with commercial heat sink in the open literature. The base temperature and thermal resistance of the heat sinks were found to drop by decreasing the fin spacing and by increasing volumetric flow rate of water circulating through the heat sink. For a flat plate heat sink, the maximum thermal resistance was 0.216 K/W that was reduced to as little as 0.03 K/W by using a heat sink of 0.2 mm fin spacing. The overall heat transfer coefficient was found to be 1297 W/m2 K and 2156 W/m2 K for the case of a flat plat and 0.2 mm fin spacing heat sinks, respectively, the latter showed about two-folds enhancement compared to the former.

[1]  D. G. Walker,et al.  Convective Performance of Nanofluids in Commercial Electronics Cooling Systems , 2010 .

[2]  Qingsong Yu,et al.  Effect of nanofluid on the heat transport capability in an oscillating heat pipe , 2006 .

[3]  E. Grulke,et al.  Anomalous thermal conductivity enhancement in nanotube suspensions , 2001 .

[4]  William W. Yu,et al.  ANOMALOUSLY INCREASED EFFECTIVE THERMAL CONDUCTIVITIES OF ETHYLENE GLYCOL-BASED NANOFLUIDS CONTAINING COPPER NANOPARTICLES , 2001 .

[5]  Somchai Wongwises,et al.  Enhancement of heat transfer using nanofluids—An overview , 2010 .

[6]  Miguel R. Oliveira Panão,et al.  Microprocessor cooling based on an intermittent multijet spray system , 2012 .

[7]  Ali Asghar Hamidi,et al.  Application of nanofluids in computer cooling systems (heat transfer performance of nanofluids) , 2012 .

[8]  Gilles Roy,et al.  Nanofluids Heat Transfer Performance for Cooling of High Heat Output Microprocessor , 2005 .

[9]  C. T. Nguyen,et al.  Heat transfer enhancement using Al2O3–water nanofluid for an electronic liquid cooling system , 2007 .

[10]  Anthony J. Robinson,et al.  A liquid-based system for CPU cooling implementing a jet array impingement waterblock and a tube array remote heat exchanger , 2012 .

[11]  Chad Bower,et al.  Heat Transfer in Water-Cooled Silicon Carbide Milli-Channel Heat Sinks for High Power Electronic Applications , 2003 .

[12]  Somchai Wongwises,et al.  Numerical investigation on the heat transfer and flow in the mini-fin heat sink for CPU , 2009 .

[13]  Rahman Saidur,et al.  Nanofluid As a Coolant for Electronic Devices: Cooling of Electronic Devices , 2012 .

[14]  S. J. Kline,et al.  Describing Uncertainties in Single-Sample Experiments , 1953 .

[15]  Somchai Wongwises,et al.  Investigation on the jet liquid impingement heat transfer for the central processing unit of personal computers , 2010 .

[16]  Ya-Ling He,et al.  Numerical study of laminar heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink , 2009 .

[17]  Wen-Quan Tao,et al.  Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink , 2007 .