1089 Pin BGA 사출성형 해석에 관한 연구

The technologies of mold design, manufacturing, injection molding process and computer aided engineering(CAE) are developed rapidly with the growth of plastic product market. CAE provide the opportunity to evaluate a filling, packing, cooling, shrinkage and warpage in mold design stage. In this study, the filling and warpage analyses of semiconductor test socket(1089pin BGA) are performed using CAE software.