Flip Chip and Heat Spreader Attachment Development
暂无分享,去创建一个
[1] S. Rzepka,et al. The effects of underfill on the reliability of flip chip solder joints , 1999 .
[2] R. Chang. Influence of cryogenic temperature and microstructure on fatigue failure of indium solder joint , 2008 .
[3] T. Noguchi,et al. Simple Ultrasonic Welding Method for Bonding Thickness Mode Transducers , 1974, IEEE Transactions on Sonics and Ultrasonics.
[4] S. E. Greer,et al. Am extended eutectic solder bump for FCOB , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.
[5] Ching-ping Wong,et al. Flip Chip Underfill: Materials, Process, and Reliability , 2009 .
[7] F. Stubhan,et al. Die bonding with Au/In isothermal solidification technique , 2000 .
[8] M. Gaynes,et al. Underfill selection strategy for Pb-free, low-K and fine pitch organic flip chip applications , 2006, 56th Electronic Components and Technology Conference 2006.
[9] P. Lundstrom,et al. Measurements of solder bump lifetime as a function of underfill material properties , 1997, Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268).
[10] N. Irving Sax,et al. Dangerous properties of industrial materials , 1957 .
[12] David M. Jacobson,et al. Principles of Soldering , 2004 .
[13] Daniel F. Baldwin,et al. Effects of substrate design on underfill voiding using the low cost, high throughput flip chip assembly process and no-flow underfill materials , 2002 .
[14] D. Suryanarayana,et al. Flip-chip solder bump fatigue life enhanced by polymer encapsulation , 1990, 40th Conference Proceedings on Electronic Components and Technology.
[15] W. H. Leong,et al. Underfill flow as viscous flow between parallel plates driven by capillary action , 1995, Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'.
[16] Viscosity of a no-flow underfill during reflow and its relationship to solder wetting , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
[17] M. Tanaka,et al. Improvement in drop shock reliability of Sn-1.2Ag-0.5Cu BGA interconnects by Ni addition , 2006, 56th Electronic Components and Technology Conference 2006.
[18] Vijay Wakharkar,et al. Materials Technologies for Thermomechanical Management of Organic Packages , 2005 .
[19] T. Dory. Simultaneous Chip-Join and Underfill Assembly Technology for Flip-Chip Packaging , 2000 .
[20] N. Tsai,et al. Underfill characterization for low-k dielectric / Cu interconnect IC flip-chip package reliability , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
[21] C. Wong,et al. Development of the wafer level compressive-flow underfill process and its required materials , 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).
[22] S. Terashima,et al. Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-xNi Flip Chip Interconnects , 2004 .
[23] T. Chuang,et al. Interfacial reactions between liquid indium and Au-deposited substrates , 2000 .
[24] A. Lidow,et al. Defining the future for microprocessor power delivery , 2003, Eighteenth Annual IEEE Applied Power Electronics Conference and Exposition, 2003. APEC '03..
[25] Fay Hua,et al. The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging , 2006 .
[26] Jinlin Wang,et al. Emerging challenges of underfill for flip chip application , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
[27] T. Suga,et al. Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition , 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).
[28] Mark M. Konarski,et al. Processing of fluxing underfills for flip chip-on-laminate assembly , 2003 .
[29] Fei Ding,et al. FLIP CHIP AND LID ATTACHMENT ASSEMBLY PROCESS DEVELOPMENT , 2006 .
[30] T. Chuang,et al. Interfacial reactions between liquid indium and nickel substrate , 1999 .
[32] Takashi Kimura,et al. Low cycle fatigue properties of Ni added low silver content Sn-Ag-Cu flip chip interconnects , 2004 .
[33] Michael Pecht,et al. Lead-free Electronics , 2006 .
[34] K. Puttlitz,et al. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies , 2004 .