Tough Bonding, On‐Demand Debonding, and Facile Rebonding between Hydrogels and Diverse Metal Surfaces
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Y. S. Zhang | T. Sun | K. Yue | Qianqian Yu | Weichang Li | Yutong Chen | Zhishuang Deng | Xiaobo Liu | Wen Tang
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Y. S. Zhang | T. Sun | K. Yue | Qianqian Yu | Weichang Li | Yutong Chen | Zhishuang Deng | Xiaobo Liu | Wen Tang