Measurement of Adhesive Force Between Mold and Photocurable Resin in Imprint Technology

Imprint lithography using photocurable resin is the most promising technique compared with other imprint lithography techniques, because it can complete a pattern transfer at room temperature. Thus, it would be able to implement practical mass-production lithography. In a previous report, however, a part of the solidified polymer was ripped away, because of strong adhesive force between the mold and solidified polymer. In order to improve this phenomenon, release coating of quartz mold and development of a photocurable resin are necessary. In this paper, we describe a measurement method of adhesive force between mold and resin using a tensile tester and, furthermore, durability of release coating material.