Enabling a Manufacturable 3D Technologies and Ecosystem using 28nm FPGA with Stack Silicon Interconnect Technology

Technology challenges and solutions in the development and manufacturing of Stacked Silicon Interconnect (SSI) Technology have been investigated with the established foundry and OSAT ecosystem. Key enabling technologies, such as TSV processing, interposer backside manufacturing yield enhancement, new stacking technology, interposer warpage control, micro-bump (μ-bump) processes and joining, that comprise the building blocks for SSI technology were developed. Xilinx 28nm FPGA with stacked silicon interconnect technology (SSIT) platform is used to develop and optimize the seamless integration of the processes, structures, parameter, as well as to evaluate the yield, reliability and device performance of them.