Value or security document with an electronic circuit and method of manufacturing the value or security document

To provide a value or security document 1000 with an electronic circuit 1270 with increased mechanical stability, especially against bending stress, the value or security document 1000 is proposed which is arranged in at least two in a stack, and with a joining method interconnected documents layers 1100, 1200, 1300 to form 1400 with the stack by a support structure position 1100 and an electronic circuit 1270 carrying the circuit carrier layer is formed 1230th The support structure layer 1100 is formed from a fiber composite material.