Parylene supported 20um*20um uncooled thermoelectric infrared detector with high fill factor
暂无分享,去创建一个
[1] T. Yamane,et al. Measurement of thermal conductivity of silicon dioxide thin films using a 3ω method , 2002 .
[2] A. Rogalski. Infrared detectors: status and trends , 2003 .
[3] Yasushi Nakajima,et al. 120 × 90 element thermoelectric infrared focal plane array with precisely patterned Au-black absorber , 2000 .
[4] Chung-Nan Chen,et al. A CMOS-MEMS Thermopile With Low Thermal Conductance and a Near-Perfect Emissivity in the 8–14-$\mu\hbox{m}$ Wavelength Range , 2011, IEEE Electron Device Letters.
[5] Vivek Goyal,et al. Exfoliation and characterization of bismuth telluride atomic quintuples and quasi-two-dimensional crystals. , 2010, Nano letters.
[6] Yu-Chong Tai,et al. Thermophysical properties of low-residual stress, Silicon-rich, LPCVD silicon nitride films , 1990 .
[7] David Kryskowski,et al. 80 x 60 element thermoelectric infrared focal plane array for high-volume commercial use , 2009, Defense + Commercial Sensing.
[8] Paul A. Silberg. Infrared Absorption of Three-Layer Films* , 1957 .
[9] Masaki Hirota,et al. Low-cost thermo-electric infrared FPAs and their automotive applications , 2008, SPIE Defense + Commercial Sensing.
[10] Chung-Nan Chen,et al. A CMOS-MEMS Thermopile With Low Thermal Conductance and a Near-Perfect Emissivity in the 8 – 14-μ m Wavelength Range , 2010 .
[11] Eric W. Jones,et al. Uncooled thermopile infrared detector linear arrays with detectivity greater than 10/sup 9/ cmHz/sup 1/2//W , 1998 .
[12] George P. Eppeldauer,et al. Gold-black coatings for freestanding pyroelectric detectors , 2003 .
[13] P. Kruse,et al. Uncooled infrared imaging arrays and systems , 1997 .
[14] Roland W. Gooch,et al. Wafer-level vacuum packaging for MEMS , 1999 .
[15] K. Goodson,et al. THERMAL CONDUCTIVITY OF DOPED POLYSILICON LAYERS , 2001, Proceeding of Heat Transfer and Transport Phenomena in Microscale.
[16] Marc C. Foote. Temperature stabilization requirements for unchopped thermal detectors , 1999, Defense, Security, and Sensing.
[17] S. Dabral,et al. The parylene-aluminum multilayer interconnection system for wafer scale integration and wafer scale hybrid packaging , 1989 .
[18] K. Wise,et al. A silicon-thermopile-based infrared sensing array for use in automated manufacturing , 1986, IEEE Transactions on Electron Devices.