The Use of "Canaries" for Adaptive Health Management of Electronic Systems
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Michael Osterman | Michael Pecht | Abhijit Dasgupta | Michael H. Azarian | Sony Mathew | Ravi Doraiswami | M. Pecht | M. Azarian | M. Osterman | A. Dasgupta | R. Doraiswami | S. Mathew
[1] A. Dasgupta,et al. Partitioned viscoplastic-constitutive properties of the Pb-free Sn3.9Ag0.6Cu solder , 2004 .
[2] M. Pecht,et al. Guidebook for managing silicon chip reliability , 1998 .
[3] G. S. Yadava,et al. Applications of artificial intelligence techniques for induction machine stator fault diagnostics: review , 2003, 4th IEEE International Symposium on Diagnostics for Electric Machines, Power Electronics and Drives, 2003. SDEMPED 2003..
[4] Jiajing Wang,et al. Canary Replica Feedback for Near-DRV Standby VDD Scaling in a 90nm SRAM , 2007, 2007 IEEE Custom Integrated Circuits Conference.
[5] Michael Pecht,et al. Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach , 1992 .
[6] Sheng Zhan,et al. Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed With No-Clean Flux , 2006, IEEE Transactions on Electronics Packaging Manufacturing.
[7] A. V. van Duin,et al. Thermal decomposition of RDX from reactive molecular dynamics. , 2005, The Journal of chemical physics.
[8] A.P. Chandrakasan,et al. Standby power reduction using dynamic voltage scaling and canary flip-flop structures , 2004, IEEE Journal of Solid-State Circuits.
[9] M. J. Cushing,et al. Comparison of electronics-reliability assessment approaches , 1993 .
[10] Albert H. C. Tsang,et al. Condition-based maintenance: tools and decision making , 1995 .
[11] Michael Osterman,et al. Strain range fatigue life assessment of lead‐free solder interconnects subject to temperature cycle loading , 2007 .
[12] D.K. Han,et al. Energetic Material/ Systems Prognostics , 2007, 2007 Annual Reliability and Maintainability Symposium.
[13] David G. Ward,et al. Helicopter gearbox diagnostics and prognostics using vibration signature analysis , 1993, Defense, Security, and Sensing.
[14] T. Martin McGinnity,et al. Fault diagnosis of electronic systems using intelligent techniques: a review , 2001, IEEE Trans. Syst. Man Cybern. Part C.
[15] Michael Pecht,et al. In-situ sensors for product reliability monitoring , 2002, Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS.
[16] M.G. Pecht,et al. Prognostics and health management of electronics , 2008, IEEE Transactions on Components and Packaging Technologies.
[17] K. Keller,et al. Aircraft electrical power systems prognostics and health management , 2006, 2006 IEEE Aerospace Conference.
[18] Peng Wang,et al. Fault prognostics using dynamic wavelet neural networks , 2001, Artificial Intelligence for Engineering Design, Analysis and Manufacturing.
[19] M. Pecht,et al. Prognostics and health management using physics-of-failure , 2008, 2008 Annual Reliability and Maintainability Symposium.
[20] T. Arslan,et al. Artificial neural network based multiple fault diagnosis in digital circuits , 1998, ISCAS '98. Proceedings of the 1998 IEEE International Symposium on Circuits and Systems (Cat. No.98CH36187).
[21] A. Dasgupta,et al. Probabilistic effects in thermal cycling failures of high-I/O BGA assemblies , 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
[22] Bart Anderson,et al. Pimtool, an Expert System to Troubleshoot Computer Hardware Failures , 1997, AAAI/IAAI.
[23] C. S. Byington,et al. Embedded diagnostic/prognostic reasoning and information continuity for improved avionics maintenance , 2003, Proceedings AUTOTESTCON 2003. IEEE Systems Readiness Technology Conference..
[24] K. Wojtek Przytula,et al. Development of Bayesian diagnostic models using troubleshooting flow diagrams , 2001, SPIE Defense + Commercial Sensing.
[25] D. Goodman,et al. A board-level prognostic monitor for MOSFET TDDB , 2006, 2006 IEEE Aerospace Conference.
[26] Seymour Morris. Use and Application of MIL-HDBK- 217 , 2006 .
[27] P. Lall,et al. Prognostics and health management of electronics , 2006, 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface.