IC component sockets

[1]  S. Avner.  Introduction to Physical Metallurgy , 1964 .

[2]  Arthur V. Tobolsky,et al.  Correlations between types of absorbed water molecules and water permeability in swollen polymer membranes , 1974 .

[3]  Michael Falk,et al.  State of water in cellulose acetate membranes , 1979 .

[4]  Michael J. Adamson,et al.  Thermal expansion and swelling of cured epoxy resin used in graphite/epoxy composite materials , 1980 .

[5]  G. H. Koch,et al.  Corrosion of Electrical Connectors , 1986 .

[6]  A. Lee,et al.  Fretting corrosion of Tin-plated copper alloy , 1987 .

[7]  A. Lee,et al.  Fretting corrosion of tin at elevated temperatures , 1988, Electrical Contacts, 1988., Proceedings of the Thirty Fourth Meeting of the IEEE Holm Conference on Electrical Contacts.

[8]  M. Darby,et al.  Moisture absorption by epoxy resins: The reverse thermal effect , 1990 .

[9]  J. R. Nis,et al.  An overview of elastomeric conductive polymer interconnection materials and their use in MCM technology , 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.

[10]  R. D. Malucci.  Dynamic model of stationary contacts based on random variations of surface features , 1992 .

[11]  M. D. Bryant.  Resistance buildup in electrical connectors due to fretting corrosion of rough surfaces , 1993, Proceedings of IEEE Holm Conference on Electrical Contacts.

[12]  Modeling the Effects of Mixed Flowing Gas (MFG) Corrosion and Stress Relaxation on Contact Interface Resistance , 1993 .

[13]  Michael D. Bryant.  Assessment of fretting failure models of electrical connectors , 1994, Proceedings of IEEE Holm Conference on Electrical Contracts.

[14]  Effects of wipe on contact resistance of aged surfaces , 1995 .

[15]  Fuad E. Doany,et al.  A novel elastomeric connector for packaging interconnections, testing and burn-in applications , 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.

[16]  Charles E Ebeling,et al.  An Introduction to Reliability and Maintainability Engineering , 1996 .

[17]  J. Galloway,et al.  Moisture absorption and desorption predictions for plastic ball grid array packages , 1996 .

[18]  R.D. Malucci,et al.  Accelerated testing of tin plated copper alloy contacts , 1997, Electrical Contacts - 1997 Proceedings of the Forty-Third IEEE Holm Conference on Electrical Contacts.

[19]  Milton Ohring,et al.  Reliability and Failure of Electronic Materials and Devices, Second Edition , 1998 .

[20]  E. M. Bock,et al.  FRETTING CORROSION IN ELECTRIC CONTACTS , 1999 .

[21]  T. B. Lim,et al.  Non-Fickian moisture properties characterisation and diffusion modeling for electronic packages , 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

[22]  M. Braunovic,et al.  Overheating of flexible tinned copper connectors , 2000, Electrical Contacts - 2000. Proceedings of the Forty-Sixth IEEE Holm Conference on Electrical Contacts (Cat. No.00CB37081).