The Roles of DNP (Distance to Neutral point) on Solder Joint Reliability of Area Array Assemblies
暂无分享,去创建一个
[1] John H. Lau,et al. Chip on Board: Technologies for Multichip Modules , 1995 .
[2] J. Lau,et al. Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies , 1996 .
[3] J. Lau,et al. Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints , 1997 .
[4] J. Lau,et al. Thermal Stress and Strain in Microelectronics Packaging , 1993 .
[5] John H. Lau,et al. Handbook Of Tape Automated Bonding , 1992 .
[6] Yifan Guo,et al. Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation , 1993, IBM J. Res. Dev..
[7] John H. Lau,et al. Handbook Of Fine Pitch Surface Mount Technology , 1993 .