Laser diode area melting for high speed additive manufacturing of metallic components

Additive manufacturing processes have been developed to a stage where they can now be routinely used to manufacture net-shape high-value components. Selective Laser Melting (SLM) comprises of either a single or multiple deflected high energy fibre laser source(s) to raster scan, melt and fuse layers of metallic powdered feedstock. However this deflected laser raster scanning methodology is high cost, energy inefficient and encounters significant limitations on output productivity due to the rate of feedstock melting. This work details the development of a new additive manufacturing process known as Diode Area Melting (DAM). This process utilises customised architectural arrays of low power laser diode emitters for high speed parallel processing of metallic feedstock. Individually addressable diode emitters are used to selectively melt feedstock from a pre-laid powder bed. The laser diodes operate at shorter laser wavelengths (808 nm) than conventional SLM fibre lasers (1064 nm) theoretically enabling more efficient energy absorption for specific materials. The melting capabilities of the DAM process were tested for low melting point eutectic BiZn2.7 elemental powders and higher temperature pre-alloyed 17-4 stainless steel powder. The process was shown to be capable of fabricating controllable geometric features with evidence of complete melting and fusion between multiple powder layers.

[1]  J. Hermsdorf,et al.  Effects of Diode Laser Superposition on Pulsed Laser Welding of Aluminum , 2013 .

[2]  Kamran Mumtaz,et al.  A Method to Eliminate Anchors/Supports from Directly Laser Melted Metal Powder Bed Processes , 2011 .

[3]  Chandrika Kamath,et al.  Observation of keyhole-mode laser melting in laser powder-bed fusion additive manufacturing , 2014 .

[4]  High-efficiency two lens laser diode to single-mode fiber coupler with a silicon plano convex lens , 1989 .

[5]  K. Mumtaz,et al.  Melting of thin wall parts using pulse shaping , 2009 .

[6]  Joel W. Barlow,et al.  The Prediction of the Emissivity and Thermal Conductivity of Powder Beds , 2004 .

[7]  Peter Loosen,et al.  Cylindrical microlenses for collimating high-power diode lasers , 1997, Other Conferences.

[8]  Lin Li The advances and characteristics of high-power diode laser materials processing , 2000 .

[9]  Study of energy efficiencies in rapid prototyping: EBM and CNC-RP , 2011 .

[10]  Ian A. Ashcroft,et al.  Transparency Built‐in , 2013 .

[11]  Ryan B. Wicker,et al.  Fabrication of Metal and Alloy Components by Additive Manufacturing: Examples of 3D Materials Science , 2012 .

[12]  G. S. Sokolovskii,et al.  Superfocusing of mutimode semiconductor lasers and light-emitting diodes , 2012 .

[14]  Yasir Jamil,et al.  Diode lasers: From laboratory to industry , 2014 .

[15]  J. Lawrence Advances in laser materials processing technology , 2010 .

[16]  D. Bergström The Absorption of Laser Light by Rough Metal Surfaces , 2008 .

[17]  Martin Traub,et al.  Brightness and average power as driver for advancements in diode lasers and their applications , 2015, Photonics West - Lasers and Applications in Science and Engineering.

[18]  D. Schuocker Handbook of the EuroLaser Academy , 2012 .

[19]  Slow axis collimation lens with variable curvature radius for semiconductor laser bars , 2016 .

[20]  High Speed Sintering: Assessing the influence of print density on microstructure and mechanical properties of nylon parts☆ , 2014 .

[21]  Vadim Laskin,et al.  Applying of refractive spatial beam shapers with scanning optics , 2011 .