Development of Metamaterial EBG Absorbers for Application of Wireless Inter/Intrachip Communication Systems

First, the chapter presents a novel design of electromagnetic bandgap (EBG) absorber with the characteristics of broad bandwidth, low profile, and polarization‐independence to a normal incident electromagnetic wave. The absorber is composed of three consecu‐ tive octagon or decagon loops, and highly‐resistive frequency selective surface (FSS) layers. Second, based on the feature of the designed absorber unit, a broadband, meta‐ material absorber‐bounded, wireless inter/intrachip (WIIC) communication channel is constructed at the center frequency of 60 GHz. Third, in order to validate the developed methodology used in WIIC analysis, a wired channel on a conventional PCB has been measured, simulated, and analyzed. Fourth, with the extracted S‐parameters of the WIIC system and wired PCB channel, the system impulse responses and transfer functions of the investigated channels have been further extracted, which are used for validation and BER analysis of the WIIC system. Finally, it has been shown that based on the derived BER results, the performance of the designed WIIC channel is close to that of an additive Gaussian white noise (AWGN) channel when the WIIC transceivers are built in with the functionalities of forward error control (FEC), channel estimation, and equalization.

[1]  Daisuke Sasaki,et al.  3D NoC with Inductive-Coupling Links for Building-Block SiPs , 2014, IEEE Transactions on Computers.

[2]  Qunsheng Cao,et al.  Crosstalk Modeling and Analysis of Through-Silicon-Via Connection in 3D Integration , 2013 .

[3]  Jianguo Guan,et al.  Broadband patterned magnetic microwave absorber , 2014 .

[4]  Stephen C. Thierauf,et al.  High-Speed Circuit Board Signal Integrity , 2004 .

[5]  Qun Wu,et al.  Broadband polarization-insensitive absorber based on gradient structure metamaterial , 2014 .

[6]  Jian Xu,et al.  Demystifying 3D ICs: the pros and cons of going vertical , 2005, IEEE Design & Test of Computers.

[7]  Xin Zheng,et al.  System level analysis and design for wireless inter-chip interconnection communication systems by applying advanced wireless communication technologies , 2016 .

[8]  Yinchao Chen,et al.  Downlink “feedback” channel design for LTE femtocell inter-cell interference mitigation , 2014, IEEE SOUTHEASTCON 2014.

[9]  Sungjoon Lim,et al.  Polarization-Independent and Ultrawideband Metamaterial Absorber Using a Hexagonal Artificial Impedance Surface and a Resistor-Capacitor Layer , 2014, IEEE Transactions on Antennas and Propagation.

[10]  Jan T. Bialasiewicz,et al.  Wavelet-Based Approach to Evaluation of Signal Integrity , 2013, IEEE Transactions on Industrial Electronics.

[11]  A. Sugavanam,et al.  On-chip antennas in silicon ICs and their application , 2005, IEEE Transactions on Electron Devices.

[12]  T. Sakurai,et al.  A 195-gb/s 1.2-W inductive inter-chip wireless superconnect with transmit power control scheme for 3-D-stacked system in a package , 2006, IEEE Journal of Solid-State Circuits.

[13]  Jin-Song Hong,et al.  An ultrathin and broadband metamaterial absorber using multi-layer structures , 2013 .

[14]  Paul A. Kohl,et al.  High-Frequency Chip Connections , 2008, Science.

[15]  G. Guo,et al.  Broadband Plasmonic Absorber for Photonic Integrated Circuits , 2013, IEEE Photonics Technology Letters.

[16]  Q. Cao,et al.  Design of a broadband electromagnetic wave absorber using a metamaterial technology , 2015 .

[17]  Liguo Sun,et al.  Frequency and Time Domain Crosstalk Signal Analysis for Integrated High-Density Circuits , 2009, 2009 WRI Global Congress on Intelligent Systems.

[18]  C. Balanis.  Advanced Engineering Electromagnetics , 1989 .

[19]  D.D. Antono,et al.  1.27Gb/s/pin 3mW/pin wireless superconnect (WSC) interface scheme , 2003, 2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC..

[20]  Duixian Liu,et al.  Antenna-on-Chip and Antenna-in-Package Solutions to Highly Integrated Millimeter-Wave Devices for Wireless Communications , 2009, IEEE Transactions on Antennas and Propagation.

[21]  Shuhui Yang,et al.  Wireless Inter/Intra-Chip Communication Using an Innovative PCB Channel Bounded by a Metamaterial Absorber , 2016, IEEE Antennas and Wireless Propagation Letters.