Experimental and simulation analysis of single and differential signals changing layers

The physical effects surrounding the transition of a signal trace from one layer to another in a PCB design is studied both experimentally and numerically. This fundamental understanding is central to motherboard designs that are free from signal integrity and EMC/EMI deficiencies. The effects due to return current path discontinuities, current coupling, trace coupling and reference plane are considered. The results are interpreted from both a signal integrity (flight times and signal quality) and EMC/EMI standpoints. The findings will help drive better design practices into the PCB world.