Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling

[1]  P. Borgesen,et al.  Effects of variable amplitude loading on lead-free solder joint propoerties and damage accumulation , 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

[2]  Yoshiharu Mutoh,et al.  Fatigue crack-growth behavior of Sn-Ag-Cu and Sn-Ag-Cu-Bi lead-free solders , 2002 .

[3]  Shu-hui Li,et al.  Forming Limits of a Sheet Metal After Continuous-Bending-Under-Tension Loading , 2013 .

[4]  Peter Borgesen,et al.  On the Assessment of the Life of SnAgCu Solder Joints in Cycling With Varying Amplitudes , 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[5]  P. Borgesen,et al.  Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue , 2015 .

[6]  D. Wei,et al.  A microscopic stored energy approach to generalize fatigue life stress ratios , 2010 .

[7]  D. W. Henderson,et al.  Isothermal Fatigue Behavior of the Near-Eutectic Sn-Ag-Cu Alloy between −25°C and 125°C , 2007 .

[8]  Peter Borgesen,et al.  Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling , 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[9]  Linlin Yang,et al.  Effects of microstructure evolution on damage accumulation in lead-free solder joints , 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

[10]  A. Mayyas,et al.  Recrystallization of Lead Free Solder Joints: Confounding the Interpretation of Accelerated Thermal Cycling Results? , 2009 .

[11]  M. Anselm,et al.  Effects of varying amplitudes on the fatigue life of lead free solder joints , 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

[12]  P. Borgesen,et al.  Challenges for the prediction of solder joint life in long term vibration , 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

[13]  P. Borgesen,et al.  Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions , 2014, Journal of Electronic Materials.

[14]  E. Cotts,et al.  The effect of Sn grain number and orientation on the shear fatigue life of SnAgCu solder joints , 2008, 2008 58th Electronic Components and Technology Conference.

[15]  H. D. Conway,et al.  An analysis of metal fatigue based on hysteresis energy , 1968 .

[16]  Peter Borgesen,et al.  Solder joint reliability under realistic service conditions , 2013, Microelectron. Reliab..

[17]  Peter Borgesen,et al.  Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue , 2012, Journal of Electronic Materials.

[18]  P. Borgesen,et al.  Statistical Variations of Solder Joint Fatigue Life Under Realistic Service Conditions , 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[19]  Linlin Yang,et al.  Recrystallization behavior of lead free and lead containing solder in cycling , 2011, Electronic Components and Technology Conference.

[20]  A. Dasgupta,et al.  Dynamic Recrystallization of Sn3.0Ag0.5Cu Pb-Free Solder Alloy , 2008 .

[21]  E. W. C. Wilkins,et al.  Cumulative damage in fatigue , 1956 .

[22]  M. Geers,et al.  Microstructure evolution in a Pb-free solder alloy during mechanical fatigue , 2006 .

[23]  Peter Borgesen,et al.  On the nature of pad cratering , 2009, 2009 59th Electronic Components and Technology Conference.

[24]  S. K. Varma,et al.  Effect of strain rate on the dislocation cell size at various stress levels during uniaxial tensile testing of electrical conductor aluminum , 1991 .

[25]  L. Yin,et al.  Towards a quantitative mechanistic understanding of the thermal cycling of SnAgCu solder joints , 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).