Low Cost Solder Bumped Flip Chip MCM‐L Demonstration
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A low cost multichip module employing solder bumped flip chips mounted on an organic substrate was demonstrated. This functional prototype was used to help assess the preliminary feasibility of low temperature solder bumped flip chip applications, from wafer design, sourcing and bumping, substrate design and fabrication, to MCM‐L assembly.
[1] J. Lau,et al. Experimental and Analytical Studies of Encapsulated Flip Chip Solder Bumps on Surface Laminar Circuit Boards , 1993 .
[2] J. Lau,et al. No Clean Mass Reflow of Large Plastic Ball Grid Array Packages , 1994 .
[3] P. A. Totta,et al. SLT device metallurgy and its monolithic extension , 1969 .
[4] Donald P. Seraphim,et al. Electronic packaging evolution in IBM , 1981 .
[5] Lewis S. Goldmann,et al. Geometric optimization of controlled collapse interconnections , 1969 .