Semiconductor package and the method of fabricating the same

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to implement a package without a wire bonding by mounting a plurality of semiconductor chips after an insertion slot is formed with LTCC technology. CONSTITUTION: A plurality of sheets(101-109) with a conductive pattern(161-169) and a via(141-146) are laminated on a package body(100). A plurality of semiconductor chips(200) are inserted into an insertion slot extended from one side of the package body. An external connection terminal(181) is provided to other side facing one side of the package body. The plurality of semiconductor chips are electrically connected to the external connection terminal. A protection sheet(195) for protecting the semiconductor chips from the outside is positioned on the package body.