Study of fatigue failure in Al-chip-metallization during power cycling
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Hakim Naceur | Daniel Coutellier | Markus Klingler | H. Naceur | M. Klingler | D. Coutellier | C. Durand | C. Durand
[1] M. Stecher,et al. A Temperature-Gradient-Induced Failure Mechanism in Metallization Under Fast Thermal Cycling , 2008, IEEE Transactions on Device and Materials Reliability.
[2] Yasushi Yamada,et al. Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device , 2007, Microelectron. Reliab..
[3] J. Newman,et al. A CTOD-Based Mixed-Mode Fracture Criterion , 1999 .
[4] P. Malberti,et al. A power-cycling-induced failure mechanism in IGBT multichip modules , 1995 .
[5] Mauro Ciappa,et al. Plastic-strain of aluminium interconnections during pulsed operation of IGBT multichip modules , 1996 .
[6] H. Naceur,et al. Failure mechanisms in chip-metallization in power applications , 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
[7] H. Reichl,et al. Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..
[8] Werner Kanert,et al. Reliability challenges for power devices under active cycling , 2009, 2009 IEEE International Reliability Physics Symposium.
[9] W. Kanert,et al. Modelling of metal degradation in power devices under active cycling conditions , 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
[10] R. Mönig,et al. Fatigue and Thermal Fatigue Damage Analysis of Thin Metal Films , 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
[11] Philippe Dupuy,et al. Characterization of alterations on power MOSFET devices under extreme electro-thermal fatigue , 2010, Microelectron. Reliab..
[12] Mauro Ciappa,et al. Selected failure mechanisms of modern power modules , 2002, Microelectron. Reliab..
[13] C. J. Santoro,et al. Thermal Cycling and Surface Reconstruction in Aluminum Thin Films , 1969 .
[14] Z. Suo,et al. Plastic ratcheting induced cracks in thin film structures , 2002 .
[15] Marc Legros,et al. In situ deformation of thin films on substrates , 2009, Microscopy research and technique.
[16] C. Durand,et al. Confrontation of failure mechanisms observed during Active Power Cycling tests with finite element analyze performed on a MOSFET power module , 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).