Three Axes MEMS Combined Sensor for Electronic Stability Control System

A microelectromechanical systems (MEMS) combined sensor measuring two-axis accelerations and an angular rate (rotation) has been developed for an electronic stability control system of automobiles. With the recent trend to mount the combined sensors in the engine compartment, the operation temperature range increased drastically, with the request of immunity to environmental disturbances such as vibration. In this paper, we report the combined sensor which has a gyroscopic part and two acceleration parts in single die. A deformation-robust MEMS structure has been adopted to achieve stable operation under wide temperature range (-40 to 125°C) in the engine compartment. A package as small as 10 × 19 × 4 mm is achieved by adopting TSV (through silicon via) and WLP (wafer-level package) technologies with enough performance as automotive grade.

[1]  A.A. Trusov,et al.  Environmentally Robust MEMS Vibratory Gyroscopes for Automotive Applications , 2009, IEEE Sensors Journal.

[2]  Keiji Hanzawa,et al.  Trends in Hitachi's MEMS Sensors for Automobiles , 2009 .

[3]  L.M. Roylance,et al.  A batch-fabricated silicon accelerometer , 1979, IEEE Transactions on Electron Devices.

[4]  Michael Curt Elwenspoek,et al.  Comb-drive actuators for large displacements , 1996 .

[5]  Paul Muralt,et al.  Design of novel thin-film piezoelectric accelerometer , 1996 .

[6]  S. Choa,et al.  Deformation Behavior of MEMS Gyroscope Sensor Package Subjected to Temperature Change , 2007, IEEE Transactions on Components and Packaging Technologies.

[7]  Peter Vettiger,et al.  Temperature dependence of the force sensitivity of silicon cantilevers , 2004 .

[8]  Wan-Thai Hsu,et al.  Stiffness-compensated temperature-insensitive micromechanical resonators , 2002, Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266).

[9]  Farrokh Ayazi,et al.  Micromachined inertial sensors , 1998, Proc. IEEE.

[10]  J. Hammond,et al.  Inertial transducer design for manufacturability and performance at Motorola , 2003, TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664).

[11]  T. Tanaka,et al.  AFM bending testing of nanometric single crystal silicon wire at intermediate temperatures for MEMS , 2001, Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090).

[12]  Dongil Kwon,et al.  Evaluation of elastic properties and temperature effects in Si thin films using an electrostatic microresonator , 2003 .

[13]  S. E. Alper,et al.  A Compact Angular Rate Sensor System Using a Fully Decoupled Silicon-on-Glass MEMS Gyroscope , 2008, Journal of Microelectromechanical Systems.