Comparison of different control strategies of power cycle test for power devices
暂无分享,去创建一个
[1] C. Basaran,et al. Failure modes and FEM analysis of power electronic packaging , 2002 .
[2] Uwe Scheuermann,et al. Power cycling results for different control strategies , 2010, Microelectron. Reliab..
[4] B. J. Baliga,et al. Trends in power semiconductor devices , 1996 .
[5] Marta Rencz,et al. Comparison of different power cycling strategies for accelerated lifetime testing of power devices , 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
[6] M. H. Abdul Halim,et al. An Overview of Data-Driven and Model-Driven Based Prognostics Techniques for Power Modules , 2018, 2018 4th International Conference on Electrical, Electronics and System Engineering (ICEESE).
[7] Mehrdad Heydarzadeh,et al. Remaining Useful Lifetime Estimation for Power MOSFETs Under Thermal Stress With RANSAC Outlier Removal , 2017, IEEE Transactions on Industrial Informatics.
[8] Chris Bailey,et al. Data driven prognostics for predicting remaining useful life of IGBT , 2016, 2016 39th International Spring Seminar on Electronics Technology (ISSE).
[9] Guang Zeng,et al. Study on power cycling test with different control strategies , 2018, Microelectron. Reliab..
[10] Marta Rencz,et al. Effect of power cycling parameters on predicted IGBT lifetime , 2015, 2015 IEEE Aerospace Conference.
[11] B. Saha,et al. Towards prognostics for electronics components , 2009, 2009 IEEE Aerospace conference.
[12] Mehrdad Heydarzadeh,et al. Bayesian remaining useful lifetime prediction of thermally aged power MOSFETs , 2017, 2017 IEEE Applied Power Electronics Conference and Exposition (APEC).
[13] Frede Blaabjerg,et al. Power Cycling Test Methods for Reliability Assessment of Power Device Modules in Respect to Temperature Stress , 2018, IEEE Transactions on Power Electronics.
[14] J.D. vanWyk,et al. A thermal, mechanical, and electrical study of voiding in the solder die-attach of power MOSFETs , 2006, IEEE Transactions on Components and Packaging Technologies.
[15] K. Goebel,et al. Prognostics approach for power MOSFET under thermal-stress aging , 2012, 2012 Proceedings Annual Reliability and Maintainability Symposium.
[16] J. Celaya,et al. Prognostics of Power Mosfets Under Thermal Stress Accelerated Aging Using Data-Driven and Model-Based Methodologies , 2011 .