Evolution of Reliability Assessment In PCB Assemblies

Very low failure rates, down to 10 FIT are now currently expected by electronic system manufacturers. In the same time, severe conditions of utili sation are common in most of industrial and commercial applications, li ke automotive sector for example. In order to assess this reliabilit y “ challenge” , process control, design and technological solutions have to be optimised to guarantee almost no defect during the operating life time. Reliabilit y testing strategy must also strongly evolve from the classical accelerated ageing statistical median life testing to the use of more sophisticated degradation laws, based on physics of failure, and in many cases computer assisted.

[1]  S. Manson.  Behavior of materials under conditions of thermal stress , 1953 .

[2]  L. Coffin,et al.  A Study of the Effects of Cyclic Thermal Stresses on a Ductile Metal , 1954, Journal of Fluids Engineering.

[3]  H. Berg,et al.  Properties of Die Bond Alloys Relating to Thermal Fatigue , 1979 .

[4]  W. Engelmaier,et al.  Functional Cycles and Surface Mounting Attachment Reliability , 1985 .

[5]  D. L. Crook,et al.  Evolution of VLSI reliability engineering , 1990, 28th Annual Proceedings on Reliability Physics Symposium.

[6]  W. Gerling.  Integration of efforts for the reliability of microelectronic devices , 1994 .

[7]  H. Kristiansen,et al.  A model for thermal fatigue of large area adhesive joints between materials with dissimilar thermal expansion , 1994, Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[8]  F. Kuper,et al.  Relation between yield and reliability of integrated circuits: experimental results and application to continuous early failure rate reduction programs , 1996, Proceedings of International Reliability Physics Symposium.

[9]  Tingyu Lin,et al.  Moisture diffusion and heat transfer in plastic IC packages , 1996 .

[10]  Finn Jensen.  Electronic Component Reliability: Fundamentals, Modelling, Evaluation, and Assurance , 1996 .

[11]  A. Casasnovas,et al.  The effects of long term dormant storage on plastic encapsulated microcircuits , 1997 .

[12]  Chris J McDonald,et al.  New tools for yield improvement in integrated circuit manufacturing: can they be applied to reliability? , 1999 .

[13]  Olivier Bonnaud,et al.  New rapid method for lifetime determination of gate oxide validated with bipolar/CMOS/DMOS technology , 1999 .

[14]  John W. Evans,et al.  Simulation of fatigue distributions for ball grid arrays by the Monte Carlo method , 2000 .

[15]  Y. Danto,et al.  Life prediction of BGA and CSP assemblies using an experimental degradation law and FEM simulations , 2000, Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146).

[16]  Uwe Scheuermann,et al.  A Novel Power Module Design and Technology for Improved Power Cycling Capability , 2001, Microelectron. Reliab..