Cofiring Kinetics and Mechanisms of an Ag-Metallized Ceramic-Filled Glass Electronic Package

Cofiring kinetics and mechanisms of an Ag-based ceramic-filled glass packaging system have been investigated. Boundary diffusion controlled solid-state sintering is identified as the controlling densification mechanism of the Ag film. For ceramic-filled glass tape, which is a mixture of glass and ceramic powders, the sintering kinetics are controlled by the viscous flow of low-softening-point glass. With the densification results of Ag film and ceramic-filled glass tape, the camber development during cofiring of a two-layerd structure of Ag film/ceramic-filled glass tape can be theoretically predicted by viscous analysis, which also agrees well with experimental observations.

[1]  J. Mackenzie,et al.  A Phenomenological Theory of Sintering , 1949 .

[2]  R. Raj,et al.  Flaw Generation During Constrained Sintering of Metal-Ceramic and Metal–Glass Multilayer Films , 1989 .

[3]  Hideo Takamizawa,et al.  Low Firing Temperature Multilayer Glass-Ceramic Substrate , 1983 .

[4]  G. Scherer,et al.  On constrained sintering-II. Comparison of constitutive models , 1988 .

[5]  V. A. Ivensen Phenomenological Theory of Sintering , 1973 .

[6]  A. Evans,et al.  Residual Stresses and Cracking in Metal/Ceramic Systems for Microelectronics Packaging , 1985 .

[7]  Sarah H. Knickerbocker,et al.  Cordierite glass-ceramics for multilayer ceramic packaging , 1993 .

[8]  Rao Tummala,et al.  Ceramic and Glass‐Ceramic Packaging in the 1990s , 1991 .

[9]  H. Eilers Die Viskosität von Emulsionen hochviskoser Stoffe als Funktion der Konzentration , 1941 .

[10]  G. Lu,et al.  Effect of Mismatched Sintering Kinetics on Camber in a Low‐Temperature Cofired Ceramic Package , 1993 .

[11]  T. Gupta,et al.  Isothermal and nonisothermal sintering kinetics of glass-filled ceramics , 1992 .

[12]  Y. Imanaka,et al.  Influence of Shrinkage Mismatch between Copper and Ceramics on Dimensional Control of the Multilayer Ceramic Circuit Board , 1992 .

[13]  R. Raj,et al.  Sintering Behavior of Ceramic Films Constrained by a Rigid Substrate , 1985 .

[14]  W. Kingery,et al.  Densification during Sintering in the Presence of a Liquid Phase. I. Theory , 1959 .

[15]  D. Turnbull,et al.  Lattice and Grain Boundary Self‐Diffusion in Silver , 1951 .

[16]  Robert L. Coble,et al.  A Model for Boundary Diffusion Controlled Creep in Polycrystalline Materials , 1963 .

[17]  J. Jean,et al.  Effect of Densification Mismatch on Camber Development during Cofiring of Nickel‐Based Multilayer Ceramic Capacitors , 2005 .

[18]  Jau-Ho Jean,et al.  Camber development during cofiring Ag-based low-dielectric-constant ceramic package , 1997 .

[19]  Rajendra K. Bordia,et al.  On constrained sintering—I. Constitutive model for a sintering body , 1988 .