Material removal rate prediction in chemical mechanical planarization with conditional probabilistic autoencoder and stacking ensemble learning

[1]  Janis Terpenny,et al.  Learning the health index of complex systems using dynamic conditional variational autoencoders , 2021, Reliab. Eng. Syst. Saf..

[2]  Pai Zheng,et al.  A novel hypergraph convolution network-based approach for predicting the material removal rate in chemical mechanical planarization , 2021, Journal of Intelligent Manufacturing.

[3]  Kai Goebel,et al.  Remaining Useful Life Prediction of Bearings Using Ensemble Learning: The Impact of Diversity in Base Learners and Features , 2020, J. Comput. Inf. Sci. Eng..

[4]  Haodong Chen,et al.  An Integrated Target Acquisition Approach and Graphical User Interface Tool for Parallel Manipulator Assembly , 2020, J. Comput. Inf. Sci. Eng..

[5]  Dazhong Wu,et al.  Predictive modeling of material removal rate in chemical mechanical planarization with physics-informed machine learning , 2019, Wear.

[6]  Dazhong Wu,et al.  Prediction of Material Removal Rate for Chemical Mechanical Planarization Using Decision Tree-Based Ensemble Learning , 2019, Journal of Manufacturing Science and Engineering.

[7]  Dazhong Wu,et al.  Predictive modelling of surface roughness in fused deposition modelling using data fusion , 2018, Int. J. Prod. Res..

[8]  Chang Ouk Kim,et al.  Recurrent feature-incorporated convolutional neural network for virtual metrology of the chemical mechanical planarization process , 2018, Journal of Intelligent Manufacturing.

[9]  Yuan Di,et al.  Adaptive virtual metrology for semiconductor chemical mechanical planarization process using GMDH-type polynomial neural networks , 2018 .

[10]  Hyunseop Lee,et al.  Slurry components in metal chemical mechanical planarization (CMP) process: A review , 2016 .

[11]  Abhijit Chandra,et al.  Performance and modeling of paired polishing process , 2016 .

[12]  Yebing Tian,et al.  An analytical investigation of pad wear caused by the conditioner in fixed abrasive chemical–mechanical polishing , 2015 .

[13]  H. S. Lee,et al.  Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes , 2013 .

[14]  Chia-Hung Chen,et al.  Invention principles and contradiction matrix for semiconductor manufacturing industry: chemical mechanical polishing , 2012, J. Intell. Manuf..

[15]  Hyunseop Lee,et al.  A wafer-scale material removal rate profile model for copper chemical mechanical planarization , 2011 .

[16]  Jongwon Seok,et al.  An integrated material removal model for silicon dioxide layers in chemical mechanical polishing processes , 2009 .

[17]  Ki-Hyun Park,et al.  Pad roughness variation and its effect on material removal profile in ceria-based CMP slurry , 2008 .

[18]  Edoardo M. Airoldi,et al.  Getting Started in Probabilistic Graphical Models , 2007, PLoS Comput. Biol..

[19]  Arun K. Sikder,et al.  Chemical mechanical planarization for microelectronics applications , 2004 .

[20]  J. Friedman.  Greedy function approximation: A gradient boosting machine. , 2001 .

[21]  David Dornfeld,et al.  Material removal mechanism in chemical mechanical polishing: theory and modeling , 2001 .

[22]  J. Friedman.  Special Invited Paper-Additive logistic regression: A statistical view of boosting , 2000 .

[23]  Ronald J. Gutmann,et al.  Chemical Mechanical Planarization of Microelectronic Materials , 1997 .

[24]  Kurt Hornik,et al.  Multilayer feedforward networks are universal approximators , 1989, Neural Networks.

[25]  J. Greenwood,et al.  Contact of nominally flat surfaces , 1966, Proceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences.

[26]  Jisheng Pan,et al.  Prediction of the surface roughness and material removal rate in chemical mechanical polishing of single-crystal SiC via a back-propagation neural network , 2021 .

[27]  Robert X. Gao,et al.  A deep learning-based approach to material removal rate prediction in polishing , 2017 .

[28]  M. Krishnan,et al.  Chemical mechanical planarization: slurry chemistry, materials, and mechanisms. , 2010, Chemical reviews.