Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep Analysis

[1]  Ching-Ping Wong,et al.  Enhancement of underfill encapsulants for flip‐chip technology , 1999 .

[2]  J. Lau.  Ball Grid Array Technology , 1994 .

[3]  G. Margaritis,et al.  The evaluation of fast-flow, fast-cure underfills for flip chip on organic substrates , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

[4]  Ching-Ping Wong,et al.  Epoxy-additive interaction studies of thermally reworkable underfills for flip-chip applications , 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

[5]  D.F. Baldwin,et al.  Advanced encapsulation processing for low cost electronics assembly-a cost analysis , 1997, Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces.

[6]  Yutaka Tsukada,et al.  A novel chip replacement method for encapsulated flip chip bonding , 1993, Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).