Electrical characteristics of n-GaN Schottky contacts on cleaved surfaces of free-standing substrates: Metal work function dependence of Schottky barrier height
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Tomoyoshi Mishima | Kenji Shiojima | T. Mishima | K. Shiojima | Hiroyoshi Imadate | Hiroyoshi Imadate
[1] T. Kimoto,et al. Nearly Ideal Current–Voltage Characteristics of Schottky Barrier Diodes Formed on Hydride-Vapor-Phase-Epitaxy-Grown GaN Free-Standing Substrates , 2010 .
[2] K. Shiojima. Atomic force microscopy and transmission electron microscopy observations of KOH-etched GaN surfaces , 1999 .
[3] M. Kuzuhara,et al. I‐V and C‐V characteristics of rare‐earth‐metal/p‐GaN Schottky contacts , 2009 .
[4] Takashi Shinohe,et al. Reverse Characteristics of a 4H-SiC Schottky Barrier Diode , 2002 .
[5] Hidetoshi Ishida,et al. Nonpolar (11-20) plane AlGaN∕GaN heterojunction field effect transistors on (1-102) plane sapphire , 2007 .
[6] Naoki Hara,et al. High performance and high reliability AlGaN/GaN HEMTs , 2009 .
[7] Bakshi,et al. Soft-x-ray photoemission study of chemisorption and Fermi-level pinning at the Cs/GaAs(110) and K/GaAs(110) interfaces. , 1988, Physical review. B, Condensed matter.
[8] T. Mukai,et al. Blue, Green, and Amber InGaN/GaN Light-Emitting Diodes on Semipolar {11-22} GaN Bulk Substrates , 2006 .
[9] Y. Tokuda,et al. A study on multiple defect states in low-carbon doped GaN layers and its correlation with AlGaN/GaN high electron mobility transistor operation , 2014 .
[10] T. Mishima,et al. Optical-Thermo-Transition Model of Reduction in On-Resistance of Small GaN p–n Diodes , 2013 .
[11] Marc Ilegems,et al. Infrared Lattice Vibrations and Free-Electron Dispersion in GaN , 1973 .
[12] H. Morkoç,et al. Low resistance ohmic contacts on wide band‐gap GaN , 1994 .
[13] Mathew C. Schmidt,et al. High Power and High External Efficiency m-Plane InGaN Light Emitting Diodes , 2007 .
[14] Ilesanmi Adesida,et al. Metal contacts to n-type GaN , 1998 .
[15] Naoki Hara,et al. High‐power GaN‐HEMT with high three‐terminal breakdown voltage for W‐band applications , 2009 .
[16] H. Amano,et al. Facet dependence of leakage current and carrier concentration in m‐plane GaN Schottky barrier diode fabricated with MOVPE , 2017 .
[17] T. Suemitsu,et al. Correlation between current–voltage characteristics and dislocations evaluated with submicrometer Schottky contacts on n-GaN grown by metalorganic chemical vapor deposition , 2003 .
[18] Joan M. Redwing,et al. The role of the tunneling component in the current–voltage characteristics of metal-GaN Schottky diodes , 1998 .
[19] Koji Katayama,et al. Extremely Low On-Resistance and High Breakdown Voltage Observed in Vertical GaN Schottky Barrier Diodes with High-Mobility Drift Layers on Low-Dislocation-Density GaN Substrates , 2010 .
[20] S. Kamiyama,et al. Control of p-Type Conduction in a-Plane GaN Grown on Sapphire r-Plane Substrate , 2005 .
[21] R. Fowler,et al. The Analysis of Photoelectric Sensitivity Curves for Clean Metals at Various Temperatures , 1931 .
[22] Hideki Hasegawa,et al. Mechanism of anomalous current transport in n-type GaN Schottky contacts , 2002 .
[23] T. Mishima,et al. Electrical characteristics of Au/Ni Schottky diodes on cleaved m-plane surfaces of free-standing n-GaN substrates , 2015 .
[24] Hadis Morkoç,et al. Reactive ion etching of GaN using BCl3 , 1994 .
[25] T. Kachi,et al. A Vertical Insulated Gate AlGaN/GaN Heterojunction Field-Effect Transistor , 2007 .
[26] S. Nakamura,et al. Candela‐class high‐brightness InGaN/AlGaN double‐heterostructure blue‐light‐emitting diodes , 1994 .
[27] R. Stratton,et al. Field and thermionic-field emission in Schottky barriers , 1966 .
[28] H. Amano,et al. Metalorganic vapor phase epitaxial growth of a high quality GaN film using an AlN buffer layer , 1986 .
[29] Toshihide Kikkawa,et al. Highly Reliable 250 W GaN High Electron Mobility Transistor Power Amplifier , 2005 .
[30] C. Carter,et al. Schottky barriers on n-GaN grown on SiC , 1996 .
[31] T. Mishima,et al. High-Breakdown-Voltage and Low-Specific-on-Resistance GaN p–n Junction Diodes on Free-Standing GaN Substrates Fabricated Through Low-Damage Field-Plate Process , 2013 .