Experimental determination of critical adhesion energies with the Advanced Button Shear Test

Abstract Interfacial delamination in semiconductor packages during their lifetime is a reliability risk. For the realisation of a “Design for Reliability” approach, the whole product needs to be studied virtually using Finite Element simulations. Only this approach allows for the evaluation of possible failure mechanisms, which is an integral part of risk analyses in reliability assessments. The Cohesive Zone Method enables the prediction of interfacial damage initiation and damage evolution in the simulation model. For accurate simulation results, not only material models need to be chosen carefully, but also the parameters for the cohesive zone. A new experimental method was proposed for the calibration of these so-called damage models, utilising the experimental setup of the Advanced Button Shear Test. Critical adhesion energies are determined based on sub-sequent shear loading, and thus, sub-critical damage evolution at the interface of the test vehicle. This paper summarises the method itself and investigations regarding the main influences on experimental results. Influences are categorised as test setup inherent, and sample inherent. Setup inherent influences can be taken into account using a new calibration routine. Sample inherent influences need to be subtracted from measurement results, or prevented with the aid of design optimisations.