论文信息 - Direct print EUV patterning of tight pitch metal layers for Intel 18A process technology node - 字舞流文

Direct print EUV patterning of tight pitch metal layers for Intel 18A process technology node

K. Fischer | R. Bigwood | N. Moumen | C. Wallace | R. Venkatesan | M. Aykol | P. Gupta | Z. Zhang | R. Rodriguez | D. Bhawe | C. Guven | B. Bains | A. R. Greenwood | P. Saksena