Signal Integrity of 2-µm-Pitch RDL Interposer for High-Performance Signal Processing in Chiplet-Based System

Given the demand for advanced I/O interfaces, we have simulated eye diagram of 2-µm-pitch signal/ground lines based on coplanar topology and compared them with those of 4-µm-pitch signal lines based on embedded microstrip topology. Simulation showed that 2-µm-pitch signal/ground lines provide better signal integrity and thus enable high-performance signal transmission to achieve high-performance signal processing in the specification of HBM3 and UCIe1.0.

[1]  S. Jeng,et al.  Organic Interposer CoWoS-R+ (plus) Technology , 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

[2]  J. Lau,et al.  2.3D Hybrid Substrate with Ajinomoto Build-Up Film for Heterogeneous Integration , 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

[3]  Tsuyoshi Tsunoda,et al.  Panel-Based Large-Scale RDL Interposer Fabricated Using 2-μm-Pitch Semi-Additive Process for Chiplet-Based Integration , 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

[4]  Kouji Sakamoto,et al.  Effectiveness of Inorganic Dielectric Layer on Submicron-scale Cu Traces against Thermal Oxidative Stress , 2021, Electronic Components and Technology Conference.

[5]  Kouji Sakamoto,et al.  Demonstration of High Electrical Reliability of Sub-2 Micron Cu Traces Covered with Inorganic Dielectrics for Advanced Packaging Technologies , 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).