论文信息 - 3-watt AlGaN-GaN HEMTs on sapphire substrates with thermal management by flip-chip bonding - 字舞流文

3-watt AlGaN-GaN HEMTs on sapphire substrates with thermal management by flip-chip bonding

S. Denbaars | U. Mishra | S. Keller | Y. Wu | B. Keller | B. Thibeault