Design and Characterization of High-Temperature ECL-Based Bipolar Integrated Circuits in 4H-SiC
暂无分享,去创建一个
R. Ghandi | M. Ostling | Luigia Lanni | L. Lanni | C. Zetterling | B. Malm | M. Ostling | R. Ghandi | C. Zetterling | B. G. Malm
[1] Jisheng Han,et al. Surface-Passivation Effects on the Performance of 4H-SiC BJTs , 2011, IEEE Transactions on Electron Devices.
[2] Steven L. Garverick,et al. Extreme temperature 6H‐SiC JFET integrated circuit technology , 2009 .
[3] Stephen J. Finney,et al. High Temperature Silicon Carbide CMOS Integrated Circuits , 2011 .
[4] Michael R. Melloch,et al. Digital CMOS IC's in 6H-SiC operating on a 5-V power supply , 1998 .
[5] J. A. Cooper,et al. Bipolar Integrated Circuits in 4H-SiC , 2011, IEEE Transactions on Electron Devices.
[6] R. Ghandi,et al. Fabrication of 2700-V 12-$\hbox{m}\Omega \cdot \hbox{cm}^{2}$ Non Ion-Implanted 4H-SiC BJTs With Common-Emitter Current Gain of 50 , 2008, IEEE Electron Device Letters.
[7] Carl-Mikael Zetterling,et al. Process technology for silicon carbide devices , 2002 .
[8] William R. Blood,et al. MECL system design handbook , 1980 .