Optimization and evaluation of the size-free integration process for MEMS-IC assembly with high yields and high efficiency

Display Omitted Chip to wafer self-alignment phenomenon was successfully identified into 3 steps.Hybrid chip-dicing process was developed for a better yield and alignment accuracy.Surface activated bonding was introduced for wafer level chip transfer at room temperature.Practically valuable for size-free and flexible MEMS-IC integration in wafer scale. Wafer level chip scale package (WLCSP) is one of the most promising methods for the integration of micro-electromechanical systems (MEMS) with integrated circuits (IC). In our previous works, we have successfully developed a 2-step approach by using a carrier wafer for size-free MEMS-IC integration. This approach exhibits both excellent process flexibility and high efficiency. This approach has been proved practically valuable when compared to chip to wafer (C2W) bonding or wafer to wafer (W2W) bonding. For the improvement of above approach, the phenomenon of the chip to carrier wafer self-alignment was investigated in this work. The process parameters and the chip-dicing processes, which may affect yields and accuracy of the self-alignment, were analyzed. A hybrid process was then proposed for chip-dicing to reduce the process cost as well as to decrease the exhaust of greenhouse gases. Moreover, a surface activated room temperature bonding process was introduced and optimized for transferring of above chips from the carrier wafer to a target wafer with less damage to those chips. A full size-free MEMS-IC integration process was finally demonstrated, and then evaluated from both electrical and mechanical points-of-view.

[1]  J. Berenschot,et al.  Fabrication of thick silicon nitride blocks for integration of RF devices , 2005 .

[2]  Frank Niklaus,et al.  Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS , 2011, IEEE Journal of Selected Topics in Quantum Electronics.

[3]  K. J. Gabriel,et al.  Post-CMOS processing for high-aspect-ratio integrated silicon microstructures , 2002 .

[4]  R. Maeda,et al.  Flexible integration of MEMS and IC for low-cost production of wireless sensor nodes , 2013 .

[5]  Andreas Dietzel,et al.  Capillary self-alignment of mesoscopic foil components for sensor-systems-in-foil , 2012 .

[6]  Lingpeng Guan,et al.  A fully integrated SOI RF MEMS technology for system-on-a-chip applications , 2006, IEEE Transactions on Electron Devices.

[7]  Loic Sanchez,et al.  Self-alignment of silicon chips on wafers: A capillary approach , 2010 .

[8]  Tolga Tekin,et al.  Review of Packaging of Optoelectronic, Photonic, and MEMS Components , 2011, IEEE Journal of Selected Topics in Quantum Electronics.

[9]  Quan Zhou,et al.  Surface-Tension-Driven Self-Alignment of Microchips on Black-Silicon-Based Hybrid Template in Ambient Air , 2013, Journal of Microelectromechanical Systems.

[10]  Jian Lu,et al.  Size-free MEMS-IC high-efficient integration by using carrier wafer with self-assembled monolayer (SAM) fine pattern , 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

[11]  Quan Zhou,et al.  Self-alignment in the stacking of microchips with mist-induced water droplets , 2011 .

[12]  W. Reinert,et al.  Investigation of key technologies for System-in-Package integration of inertial MEMS , 2009, 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS.

[13]  Quan Zhou,et al.  Hybrid Microassembly Combining Robotics and Water Droplet Self-Alignment , 2010, IEEE Transactions on Robotics.

[14]  A. Witvrouw,et al.  CMOS-MEMS Integration: Why, How and What? , 2006, 2006 IEEE/ACM International Conference on Computer Aided Design.

[15]  Yusuf Leblebici,et al.  Surface-tension-driven multi-chip self-alignment techniques for heterogeneous 3D integration , 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

[16]  Dacheng Zhang,et al.  Inter-CMOS process for monolithic integrated MEMS resonator , 2012, 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology.

[17]  Quan Zhou,et al.  Low-height sharp edged patterns for capillary self-alignment assisted hybrid microassembly , 2014 .

[18]  Chia-Yen Lee,et al.  Wireless Remote Weather Monitoring System Based on MEMS Technologies , 2011, Sensors.

[19]  M. E. Kiziroglou,et al.  A MEMS Self-Powered Sensor and RF Transmission Platform for WSN Nodes , 2011, IEEE Sensors Journal.

[20]  Jian Lu,et al.  High-Efficient Chip to Wafer Self-Alignment and Bonding Applicable to MEMS-IC Flexible Integration , 2013, IEEE Sensors Journal.