Design optimization of condenser microphone: a design of experiment perspective.

A well-designed condenser microphone backplate is very important in the attainment of good frequency response characteristics--high sensitivity and wide bandwidth with flat response--and low mechanical-thermal noise. To study the design optimization of the backplate, a 2(6) factorial design with a single replicate, which consists of six backplate parameters and four responses, has been undertaken on a comprehensive condenser microphone model developed by Zuckerwar. Through the elimination of insignificant parameters via normal probability plots of the effect estimates, the projection of an unreplicated factorial design into a replicated one can be performed to carry out an analysis of variance on the factorial design. The air gap and slot have significant effects on the sensitivity, mechanical-thermal noise, and bandwidth while the slot/hole location interaction has major influence over the latter two responses. An organized and systematic approach of designing the backplate is summarized.

[1]  Jianmin Miao,et al.  Analytical modeling for bulk-micromachined condenser microphones , 2006 .

[2]  J. Bergqvist,et al.  A silicon condenser microphone using bond and etch-back technology , 1994 .

[3]  Wouter Olthuis,et al.  Improvement of the performance of microphones with a silicon nitride diaphragm and backplate , 1994 .

[4]  Allan J. Zuckerwar,et al.  Measured 1/f noise in the membrane motion of condenser microphones , 1994 .

[5]  Allan J. Zuckerwar,et al.  Theoretical response of condenser microphones , 1978 .

[6]  E. Jakeman,et al.  Thermal oscillations and their effect on solidification processes , 1972 .

[7]  Chee Wee Tan,et al.  A study on the viscous damping effect for diaphragm-based acoustic MEMS applications , 2007 .

[8]  Mary B Chan-Park,et al.  Design of experiment for optimization of plasma-polymerized octafluorocyclobutane coating on very high aspect ratio silicon molds. , 2006, Langmuir : the ACS journal of surfaces and colloids.

[9]  Allan J Zuckerwar,et al.  Background noise in piezoresistive, electret condenser, and ceramic microphones. , 2003, The Journal of the Acoustical Society of America.

[10]  W. Kühnel,et al.  A silicon condenser microphone with structured back plate and silicon nitride membrane , 1992 .

[11]  Jianmin Miao,et al.  Sensitivity-improved silicon condenser microphone with a novel single deeply corrugated diaphragm , 2001 .

[12]  Z. Skvor,et al.  On the acoustical resistance due to viscous losses in the air gap of electrotastic transducers , 1969 .

[13]  Bin Liu,et al.  A new measurement microphone based on MEMS technology , 2003 .

[14]  Z. F. Wang,et al.  Chemical mechanical polishing of polymeric materials for MEMS applications , 2006, Microelectron. J..

[15]  T. Gabrielson Mechanical-thermal noise in micromachined acoustic and vibration sensors , 1993 .

[16]  Viggo Tarnow The lower limit of detectable sound pressures , 1987 .

[17]  T. B. Gabrielson,et al.  Fundamental noise limits for miniature acoustic and vibration sensors , 1991 .

[18]  J. B. Starr Squeeze-film damping in solid-state accelerometers , 1990, IEEE 4th Technical Digest on Solid-State Sensor and Actuator Workshop.