Memory module and solid state disk having the same

The memory module is being sequentially respectively connected to the control signal line, and said control signal line for transmitting a control signal to place at least in two rows in a second direction package columns comprising a plurality of semiconductor packages are arranged in a first direction It includes. Any one of the semiconductor packages in the first row along the control signal line is any one of the semiconductor package connecting the first and the second row of the control signal line is connected to the second.