A New Packaging Trend:Wafer Level Packaging

Electronic packaging plays a very important role in military electronic component and home applica-tion consumer circuit. Nowadays,electronics changes very quickly. Integrated circuit is developing rapidly towards super scale,hypervelocity,high density,high power,high-accuracy and multifunction. It demands packaging technology more and more highly. Thus,new packaging forms come forth unfailingly,new packaging technologies emerge in endlessly. This paper presents a new packaging trend: wafer level packaging technology,mainly describes the concept of WLP in details,its technical drive,and lists the major corporations in the arena of WLP.